Electronic component manufacturer: Soldering matters and specific steps for integrated circuits (ICs)
Release Date:
2023-01-03 17:49
Source:
Electronic component manufacturer: Preparation for soldering integrated circuits (ICs). Integrated circuits have many densely packed pins; small integrated circuits can have dozens to hundreds of pins, making soldering difficult. Therefore, the following preparations must be made before soldering. Let's learn about the soldering matters and specific steps for integrated circuits (ICs).
I. Electronic component manufacturer: Preparation for soldering integrated circuits (ICs):
1. Soldering tools
When using a 25W soldering iron, the tip should be pointed. Use a file to trim the tip, avoiding burrs that could snag the leads during soldering.
2. Electronic component manufacturer: Soldering materials
Soldering materials mainly include rosin, solder wire, solder paste, thinner, and pure alcohol. The solder wire must be low-melting-point.
3. Clean the printed circuit board
Before soldering, flatten the printed circuit board with a spatula. Use a small brush dipped in thinner to clean the area to be soldered. Carefully check the printed circuit board for peeling or debris. If there is peeling, simply flatten it; however, if it's broken, connect it with a thin copper wire.
4. Electronic component manufacturer: Tinning the leads
New integrated circuits have solder on the leads when they leave the factory and require no treatment. For used ICs, remove lead contaminants and adjust the tinning of the leads before use.
II. Electronic component manufacturer: Specific steps for soldering integrated circuits (ICs):
Place the integrated circuit (IC) on the printed circuit board, aligning the leads. Solder the first and last pins of each row to prevent the IC from shifting, then use the "drag soldering" method. Drag soldering involves applying solder to the iron tip and gently dragging it along the entire lead row from left to right, soldering each lead to the printed circuit board.
After soldering, inspect each solder joint. If there is excess solder, resolder it with the soldering iron. Wipe the leads with a pure alcohol cotton ball to remove rosin and solder residue.
III. Electronic component manufacturer: Precautions for soldering integrated circuits (ICs):
The soldering iron should be unpowered or grounded. After heating, unplug the power or ground the soldering iron casing to prevent induced charges from damaging the integrated circuit. This is especially important when soldering MOS ICs.
Soldering time should not be too long. Pay attention to temperature and time when soldering integrated circuits. Generally, the temperature for IC soldering is 260°C for 10 seconds or 350°C for 3 seconds. This refers to the allowable temperature and time for all leads of an IC simultaneously being 1-1.5mm from the package base plane. Therefore, the temperature for spot welding and soldering is generally 250°C.
Pay attention to heat dissipation. Some high-power integrated circuits have good heat dissipation. When replacing an integrated circuit, refasten the heat sink to ensure close contact with the IC to prevent heat damage. When installing the heat sink,
Electronic component manufacturer: The above is an introduction to the soldering matters and specific steps for integrated circuits (ICs). For more information, please contact us! Our company has years of experience and looks forward to your participation.
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